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RFID antenna die cutting solution!RFID Animal Seal

source:Industry News Popular:rfid fpc tag release time:2021-09-27 09:11:13 Article author:sznbone

  RFID antenna die cutting solution

  1. RFID antenna die-cutting characteristics analysis mold requirements:

  Although we use a self-adhesive structure to make our antenna, our surface material is metal aluminum or steel. Jinyan is relatively prone to loss of knife molds. For non-Jinyan materials, etching molds can generally be die-cut 200,000 times. For Zijinyan, it must be repaired or discarded after about 20,000 times. Therefore, we can choose a better mold material and heat treatment on the blade to increase the hardness of the blade.

  The RFID antenna pattern is relatively fine and complex, and the spacing is relatively small, and the line width is generally about imm.

  Therefore, we choose a high-precision etching knife or an engraving mold, and generally choose a single-peak knife mold, with the beveled surface facing out, and the beveled surface facing inward, so as to ensure that the cut line width is 1mm and is straight.

  Die cutting material requirements:

  As mentioned earlier, the strength of the face material has a great influence on waste discharge. The aluminum foil we use is generally around 18um. At this time, its strength is very weak, and it basically breaks by pulling it by hand; directly using a single-layer aluminum foil or steel foil as the surface material, the strength is obviously insufficient. To this end, we added a layer of reinforcement on the back of the aluminum foil. Here we choose a 10um thick PET, as shown in Figure 3.

  In order to save money, we choose release paper as the antenna substrate. Adhesive For the convenience of waste discharge and die cutting, we choose water-emulsified glue as our adhesive layer. The glue layer is again around 20um.

  Analysis of difficulties in waste disposal:

  The RFID overclocking antenna pattern is finely circled, which makes it extremely difficult to discharge waste in the die-cutting process. This is also the difficulty of die-cut antennas. Specifically, there are the following features (we take the reference antenna provided by NXP as an example, Figure 5):

  There is a closed loop. Generally, in order to adjust the impedance of a dipole antenna to match the chip, there are T-shaped matching structures or inductive coupling structures in the antenna structure; these impedance matching structures are basically a closed ring. Direct waste discharge is basically impossible.

  In order to adjust the real part of the antenna in the antenna structure, the T-shaped matching structure is only connected with the velvet radiating part in the middle part. There is a gland between the other part of the T-shaped structure and the antenna radiating part. This gap is perpendicular to the bending line and the normal layout direction, which is generally not good for waste discharge.

  In order to miniaturize dipole antennas, bending wire technology is generally used. The spacing of the bending lines is generally about 1mm-2mm. The bending height is about 8mm. These slender bends are more difficult to discharge. After adding the reinforcement layer, we found that the bend line gap at one end can be directly drained, and the bend line gap at the other end is not easy to drain.

  Also for miniaturization, the antenna end sometimes has a folded structure, which is quite a closed loop, which brings greater difficulties to waste discharge.

  2. Viscose die-cutting and waste discharge plan

  Aiming at the delicate and complicated situation of the RFID antenna, we have proposed an antenna manufacturing plan that is die-cutting twice and discharging waste twice. We divide the antenna into two parts: the internal pattern and the frame pattern. The frame pattern is a very regular pattern that can be directly discharged; while the internal pattern is difficult to arrange, we divide it into separate patterns and glue them to remove the arrangement.

  Principle of viscose waste discharge:

  Viscose waste discharge is mainly based on the relative size of adhesion to achieve the purpose of waste discharge. As shown in Figure 7, the purple part is the waste discharge part, they are separated "islands". The remaining pattern parts are connected together as a whole. Adhesive tape is attached to the pattern of waste discharge. When the adhesive is lifted and passes through the "island", the area of the "island" is relatively small. The adhesive force of the "island" part of the adhesive tape team is larger than the adhesion between the "island" part and the release paper. Power, the "island" part is

  Transfer to adhesive tape. When the adhesive tape passes through the pattern to be retained, the area of the pattern to be retained is large. The adhesive force of the adhesive tape to the "island" part is less than the adhesive force of the part to be retained and the release paper, so it is wilted. The retained image will eventually remain on the release paper. In this case, the separated "island" will be taken out by the adhesive tape, and the remaining pattern layer will remain on the release paper, thus achieving the waste removal. Purpose.


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